Job title: Internship – Die Prep Process Module Engineering (July onwards intake)
Company: Western Digital
Job description: project assigned by supervisor/engineer from new process development department. Perform engineering study and data…/Science, Material Science, Electrical, Electronics, Mechanical Engineering field Good communication skill. Additional…
Expected salary:
Location: Perai, Pulau Pinang
Job date: Fri, 08 Mar 2024 03:46:59 GMT
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